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  • 產(chǎn)品名稱：SiNx襯底21630-55

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  • 產(chǎn)品廠商：Ted pella
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簡單介紹：
200nm SiNx on Ultra-Flat Silicon Wafer, 5 x 5mm pieces in a Gel-Pak? box
詳情介紹：
6" Silicon Wafer
Ultra-Flat SiNx Coated Wafer
5 x 5mm SiO2 diced wafer
5 x 5mm Diced Ultra-Flat SiNx on Silicon Substrates

Ultra-Flat SiNx Coated Substrates

The Ultra-Flat SiNx Substrates consist of ultra-flat silicon wafers coated with 200nm of amorphous nonstoichiometric ultra low-stress silicon nitride, similar to our silicon nitride grids. The ultra-flat SiNx substrates are available in 6" wafer and conveniently diced 5 x 5mm, 5 x 7mm and 10 x 10mm chips. The 6" wafer is shipped in a 6" wafer carrier; the diced pieces are shipped in a Gel-Pak® Box.

The wafers are stealth diced, a special clean dicing process which produces debris-free substrates. All products are packed in class 10 clean room conditions.

Properties for thermal SiNx substrates:

  • Material: CZ Virgin Silicon
  • Wafer Grade: Prime
  • Diameter: 150mm
  • Orientation: <100>
  • Type/Dopant: P/Boron
  • Resistivity: 10-20 Ohm-cm
  • Thickness: 675 +/- 25μm
  • TTV: ≤2μm
  • Site Flatness: ≤1μm
  • Warp: ≤30μm
  • Bow: ≤20μm
  • Front Surface: Polished
  • Back Surface: Etched
  • Flat: 1 per SEMI Standard
  • 2000A +/- 100A SiNx
Prod # Description Unit
21630-6 200nm SiNx on Ultra-Flat Silicon Wafer, in 6" wafer carrier each
21630-55 200nm SiNx on Ultra-Flat Silicon Wafer, 5 x 5mm pieces in a Gel-Pak® box box/25
21630-57 200nm SiNx on Ultra-Flat Silicon Wafer, 5 x 7mm pieces in a Gel-Pak® box box/18
21630-510 200nm SiNx on Ultra-Flat Silicon Wafer, 10 x 10mm pieces in a Gel-Pak® box box/6
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